Engineers mix and match materials to make new stretchy electronics

A process developed by MIT engineers may be the key to manufacturing flexible electronics with multiple functionalities in a cost-effective way. The process is called  “remote epitaxy” and involves growing thin films of semiconducting material on a large, thick wafer of the same material, which is covered in an intermediate layer of graphene. Once the researchers grow a semiconducting film, they can peel it away from the graphene-covered wafer and then reuse the wafer, which itself can be expensive depending on the type of material it’s made from. In this way, the team can copy and peel away any number of thin, flexible semiconducting films, using the same underlying wafer. MIT is a NYSERNet member. Read more here:

Image credit: Felice Frankel